DARPA NGMM and 3DHI: Transforming Microelectronics for Defense and AI DARPA’s Next-Generation Microelectronics Manufacturing program is driving 3D Heterogeneous Integration, redefining chip technology for secure, high-performance defense and computing applications. Introduction: A National Effort to Reclaim Microelectronics Dominance The Defense Advanced Research Projects Agency (DARPA) has initiated a transformative effort …

Introduction As the digital world accelerates into the era of 6G and beyond, our need for ultra-high-speed data transmission is pushing the limits of current communication technologies. One of the most promising frontiers in this pursuit is the terahertz (THz) frequency band—an underutilized region of the electromagnetic spectrum located between …

Harnessing the Sun: How Solar Farms Are Accelerating the Clean Energy Transition From agrivoltaics to AI-powered grids, solar farms are reshaping the global energy landscape—delivering clean power, healthier communities, and a brighter future. As the planet grapples with the escalating impacts of climate change, solar energy has emerged as one …