Category Material

DARPA NGMM for manufacturing Next Generation 3DHI (three-dimensional heterogeneous integration) microsystems

DARPA NGMM and 3DHI: Transforming Microelectronics for Defense and AI DARPA’s Next-Generation Microelectronics Manufacturing program is driving 3D Heterogeneous Integration, redefining chip technology for secure, high-performance defense and computing applications. Introduction: A National Effort to Reclaim Microelectronics Dominance The Defense…

Pushing the Boundaries of Superconductivity: Investigating the Materials and Technologies behind High-Temperature Superconductors

High-Temperature Superconductors: The Breakthroughs Driving Energy, Transport, and Quantum Innovation From lossless power grids to quantum computers, high-temperature superconductors are bringing the future of energy, transport, and technology closer than ever. Introduction In 1911, Dutch physicist Heike Kamerlingh Onnes discovered…