Nanofluids for thermal management of Space and Nuclear systems, military vehicles and submarines, power electronics and directed-energy weapons

Because of higher density chips, the design of more compact electronic components makes heat dissipation even more difficult. All advanced electrical or electronic devices are facing heat management challenges due to the increased levels of heat generation and the reduction in the surface area for heat rejection or dissipation. So a reliable heat management system is very important for the continuous and smooth working of these modern electronic devices.