Integrated circuits and power devices utilized by the semiconductor industry for the production of advanced computers, consumer electronics, communication networks, and industrial and military systems have been almost exclusively based on silicon technology. The requirements of future electronics place a great emphasis on achieving new devices with greater power density and energy efficiency, especially in the power electronics arena. This emphasis poses an increasing challenge to come up with new design protocols, innovative packaging, and even new semiconductor materials, as it is widely believed that silicon technology has finally reached its fundamental physical limits. In addition to the devices’ electrical requirements such as voltage and power ratings, the operational environments of power systems might encompass challenging conditions that include radiation, extreme temperature exposure, and wide-range thermal cycling, where conventional silicon-based systems are incapable of survival or efficient operation.
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