https://youtu.be/IsxHn1whyxE DARPA NGMM and 3DHI: Transforming Microelectronics for Defense and AI DARPA’s Next-Generation Microelectronics Manufacturing program is driving 3D Heterogeneous Integration, redefining chip technology for secure, high-performance defense and computing applications. Introduction: A National Effort to Reclaim Microelectronics Dominance The Defense Advanced Research Projects Agency (DARPA) has initiated a transformative effort to solidify U.S. leadership…
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